Intel Packaging R&D Engineer in Phoenix, Arizona
Microelectronic Packaging Engineers provide project management package design and/or development and sustaining support for integrated circuit or semiconductor assemblies various other electronic components and/or completed units.
In this job you will be responsible for the thermal and/or mechanical design analysis and development of electronic packages.
Candidate may be responsible for:
Developing novel thermal solutions for meeting thermal demands across all market segments ranging from hand held devices with constrained physical and thermal environments to higher power server products.
Defines overall package performance and specification and realizes technology certification through layout design and test vehicle design.
Conducts tests and research on basic materials and properties.
Provides consultation concerning packaging problems and improvements in the packaging process.
Responds to customer and/or client requests or events as they occur Develops solutions to problems utilizing formal education and judgment.
As part of the job function you will also be expected to work in a team environment and interact with other engineers to define and implement numerical and lab experiments for feasibility and validation of concepts and solutions to support new package technology development.
The scope will include 3D thermal and CFD modeling using commercially available tools like Ansys Fluent and/or Icepak and Flotherm and experimental data collections
The candidate will also be responsible for conducting tests and research on basic materials and properties.
The candidate should also exhibit the following behavioral traits and/or skills
Excellent documentation skills:
Work with cross functional teams
Organizational multitasking and self-direction skills
Familiarity with analysis tools like Matlab and/or MathCAD
Familiarity with the CAD software such as Solid works and PROE
Hands on measurements expertise required in the thermal and/or fluid flow analysis of IC packaging
Familiarity with packaging assembly processes and failure analysis
Industry experience in design and high volume manufacturing
Working knowledge of lab data collection tools like LabVIEW
You must possess the below minimum qualifications to be initially considered for this position.
Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Experience listed below would be obtained through a combination of your school work classes, research and/or relevant previous job and/or internship experiences
The candidate must possess a MS or PhD in Mechanical Engineering
The candidate must have knowledge of heat transfer and fluid dynamics
The candidate should demonstrate experience in successful application of heat transfer and fluid dynamics fundamentals to his/her thesis or research work
6 + months of work or educational experience in computational fluid dynamics (CFD) numerical techniques for thermal and fluid flow modeling such as finite volume/difference/element approaches and/or 6 + months of work or educational experience in hands-on measurements expertise required in the thermal and/or fluid flow analysis.6 + months of work or educational experience in computational fluid dynamics (CFD) numerical techniques for thermal and fluid flow modeling such as finite volume/difference/element approaches and/or 6 + months of work or educational experience in hands-on measurements expertise required in the thermal and/or fluid flow analysis.
- Exposure to commercial software tools such as ANSYS FLUENT FLOWTHERM ICEPAK COMSOL and/or Flow3D
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.