Microchip Technology Principal Engineer-Packaging in Chandler, Arizona
Microchip Technology Inc. is a leading provider of embedded control applications. Our product portfolio comprises general purpose and specialized 8-bit, 16-bit, and 32-bit microcontrollers, 32-bit microprocessors, field-programmable gate array (FPGA) products, a broad spectrum of high-performance linear, mixed-signal, power management, thermal management, radio frequency (RF), timing, safety, security, wired connectivity and wireless connectivity devices, as well as serial Electrically Erasable Programmable Read Only Memory (EEPROM), Serial Flash memories, Parallel Flash memories, and serial Static Random Access Memory (SRAM). We also license Flash-IP solutions that are incorporated in a broad range of products.
The Principal Engineer - Packaging will work primarily in conjunction with the lead Packaging engineer to support the package NPI development for multiple Microchip business units. She/he will be responsible for a wide range of tasks, such as review & approval of preliminary and production assembly documentation, assembly BD & DRCs, various assembly processes DOEs, first-level technical support of all packaging related electrical/thermal and other requests from the BUs, managing all package and packing mass production documents related to new products, as well as managing all new package qualifications and FA work related to them. The candidate must have a very strong package reliability knowledge & experience to successfully drive all stress tests work to completion. Microchip is seeking a qualified individual to join the Package Development team in Chandler (AZ), or Hauppauge (NY).
Essential duties and responsibilities are:
Working closely with Microchip approved assemblers to set various DOEs, simulation work, BOM selection, as well as FA related work on new development
Managing all necessary engineering BDs for the new product families
Generating PKG qual doc sets for pre-approval of the qualification
Preparing all necessary docs for initiating the necessary assembly DOEs (Singulation, DA, WB, etc.)
Reviewing and approving the completed DOEs
Preparing the doc sets to release the PKG qual lots builds, as well as the T&R quals (if needed)
Managing & driving all PKG stress tests activities, and supporting any assembly/package related issues until resolution is achieved
Reviewing and approving the final PKG qualification reports throughout Microchip qual system
Supporting the initial generation of all new production BDs for the related NPIs
Providing the necessary packing information (T&R, tray, etc.) for the NPIs and internal spec updates
Supporting the generation of the final production PODs for all new packages
Managing the pre-production ramp-up lots builds and tests
Ability to work with cross function teams inside and outside Microchip, to help in the rapid package development and introduction to mass production
BS Degree (MS preferred) in Mechanical, Electrical, or Material Science Engineering, or related technical field
Minimum 10 years experience in IC packaging, reliability/qualification, assembly and quality
Knowledge in semiconductor product development from design, materials, characterization, qualification, test and failure analysis to mass production launching
Understanding of all IC assembly processes including die attach, wire-bond, flip chip, singulation, surface mount, etc.
Good understanding of laminate and leadframe based package technologies
Ability to work with AutoCAD
Proficiency with MS Office Suite (Excel, Word, and PowerPoint) is required
Must be proficient in communicating in English
Microchip is an Equal Opportunity/Affirmative Action Employer of Disabled/Veterans/Minorities/Women. We provide equal employment and affirmative action opportunities to applicants and employees without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, protected veteran status, disability, or any other basis protected under applicable federal, state or local laws.